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GBPC1506T データシート

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GBPC1506T
GENESIC
GeneSiC Semiconductor, Inc. GENESIC
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Features
• Integrally molded heat sink provides low thermal resistance for maximum heat dissipation
• High surge current capability
• Void-free junction soldering by using vacuum soldering
• Universal 3-way terminals: snap on, wire-around, or P.C board mounting
• High temperature soldering guaranteed: 260°C/ 10 seconds at 5 lbs (2.3 kg) tension
• Not ESD Sensitive

 

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