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MXP1018-C データシート

部品番号 コンポーネント説明 メーカー
MXP1018-C Photo SCR Chip Microsemi
Microsemi Corporation Microsemi
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MXP1018-C image

Features
• Light Activated Photo SCR
• Planar PNPN
• High Voltage
• Cathode and Gate pads are Aluminum Wire bondable
• Anode is backside of die
• Backside metallization - Gold
• Die Attach methods: eutectic or epoxy


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