Package mechanical data
5
Package mechanical data
M48Z32V
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Figure 8. SO44 – 44-lead plastic, small package outline
A2
A
C
B
e
CP
D
N
Note:
1
SOH-C
EH
A1 α L
Drawing is not to scale.
Table 13. SO44 – 44-lead plastic, small package mechanical data
mm
inch
Symbol
Typ
Min
Max
Typ
Min
A
3.05
A1
0.05
0.36
0.002
A2
2.34
2.69
0.092
B
0.36
0.46
0.014
C
0.15
0.32
0.006
D
17.71
18.49
0.697
E
8.23
8.89
0.324
e
0.81
–
–
0.032
–
H
11.51
12.70
0.453
L
0.41
1.27
0.016
a
0°
8°
0°
N
44
44
CP
0.10
Max
0.120
0.014
0.106
0.018
0.012
0.728
0.350
–
0.500
0.050
8°
0.004
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