NXP Semiconductors
PCA9535A
Low-voltage 16-bit I2C-bus I/O port with interrupt
Footprint information for reflow soldering of HVQFN24 package
D
C
(0.105)
Hx
Gx
P
nSPx
Hy Gy
nSPy
0.025
SPx
SPy
SOT994-1
0.025
SLy By Ay
SPx tot
solder land
SLx
Bx
Ax
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder paste deposit
solder land plus solder paste
occupied area
nSPx nSPy
2
2
Dimensions in mm
P
Ax
Ay
Bx
By
C
D SLx SLy SPx tot SPy tot SPx SPy Gx Gy Hx Hy
0.500 5.000 5.000
Issue date
07-09-24
09-06-15
3.200
3.200
0.900
0.240
2.100
2.100
1.200
Fig 33. PCB footprint for SOT994-1 (HWQFN24); reflow soldering
1.200
0.450 0.450 4.300 4.300 5.250 5.250
sot994-1_fr
PCA9535A
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 11 September 2012
© NXP B.V. 2012. All rights reserved.
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