CXA1645P/M データシートの表示（PDF） - Sony Semiconductor

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CXA1645P/M

RGB Encoder

Sony Semiconductor 

Package Outline

Unit: mm

CXA1645P

24

24PIN DIP (PLASTIC) 400mil

+ 0.4

30.2 – 0.1

13

1

12

2.54

0° to 15°

CXA1645P/M

0.5 ± 0.1

1.2 ± 0.15

SONY CODE

EIAJ CODE

JEDEC CODE

DIP-24P-01

∗DIP024-P-0400-A

PACKAGE STRUCTURE

PACKAGE MATERIAL EPOXY RESIN

LEAD TREATMENT

SOLDER PLATING

LEAD MATERIAL

COPPER / 42 ALLOY

PACKAGE WEIGHT

2.0g

CXA1645M

24PIN SOP (PLASTIC)

+ 0.4

15.0 – 0.1

24

13

+ 0.4

1.85 – 0.15

0.15

+ 0.2

0.1 – 0.05

1

0.45 ± 0.1

12

1.27

+ 0.1

0.2 – 0.05

± 0.12 M

SONY CODE

EIAJ CODE

JEDEC CODE

SOP-24P-L01

∗SOP024-P-0300-A

PACKAGE STRUCTURE

MOLDING COMPOUND EPOXY/PHENOL RESIN

LEAD TREATMENT

SOLDER PLATING

LEAD MATERIAL

COPPER ALLOY / 42ALLOY

PACKAGE WEIGHT

0.3g

– 14 –

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