MITSUBISHI <CONTROL / DRIVER IC>
M56786FP
SPINDLE MOTOR AND 1CH ACTUATOR DRIVER
THERMAL DERATING
6.0
(W)
5.0
4.0
3.0
2.0
1.0
4.1W
using H-type board
3.1W
using I-type board
2.9W
using J-type board
This IC's package is POWER-SSOP, so improving the board on
which the IC is mounted enables a large power dissipation without
a heat sink.
For example, using an 1 layer glass epoxy resin board, the IC's
power dissipation is 2.9W at least. And it comes to 4.1W by using
an improved 2 layer board.
The information of the H, I, J type board is shown in the board
information.
0
25
50
75
100
125
150
Ambient Temperature Ta (˚C)