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5962-8864406XX データシートの表示(PDF) - Aeroflex UTMC

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5962-8864406XX
UTMC
Aeroflex UTMC UTMC
5962-8864406XX Datasheet PDF : 23 Pages
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Notes:
1. All package finishes are per MIL-M-38510.
2. It is recommended that package ceramic be mounted on a heat removal
rail in the printed circuit board. A thermally conductive material such as
MERECO XLN-589 or equivalent should be used.
3. Letter designations are for cross-refernce to MIL-M-38510.
Figure 14. 36-Pin Lead Flatpack
(100-MIL Lead Spacing)
18

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