MT1389 データシートの表示（PDF） - Unspecified
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MT1389 Datasheet PDF : 40 Pages
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Specifications are subject to change without notice
13-2 Pre-process and Heat Treatment
Procedure: (MRT L3)
[Package opening] Æ [Baking] Æ [Humidification] Æ [Reflow]
A. Conditions between each step of procedure
Be lift for duration of 2 hours or longer at temperature of 30 oC or lower and a humidity of 60% R.H.
or lower.
B. Baking 125 oC, 24 hours.
ly C. Humidification: 30 oC, 60% R.H., 192 Hours
n D. Reflow: 3 x 260 oC
l O 14 Manual Solder Condition
tia k The specimen should be in the as-delivered condition. Set the soldering iron at a temperature of 300 +/- 10 oC
n e (at the iron bit). Place the iron and flux-cored solder in parallel with each and every terminal/lead on the back
e T of the board for a duration which does not exceed 5 seconds without applying any mechanical stress on the
fid e component body.
in It can also be applied under 350 +/- 10 oC at the iron bit within 3 seconds, please treat it carefully under such
n condition.
o ng e The chip can’t do DIP soldering.
C iE sur 15 Storage Condition
TK ig lo 15-1 Storage Duration
A. Notice the Sealing time.
D c B. 12 monthly and storage condition: <= 40oC , <= 90% R.H.
M r is C. Warehouse control: First in and First out.
o D 15-2 After Open the Bag
F A. SMT: Should finish the SMT process within 168 hours
o B. Check the humidity check card: The value should < 20% (blue), if the value >= 30% (red), it means
N the IC has got moisture.
C. Factory environment control: <= 30oC, <= 60% R.H.
16 Other
If a doubt related to the present specifications arises, the problem will be solved based on discussion between
the both parties.
40
MEDIATEK CONFIDENTIAL, NO DISCLOSURE
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