MC80F0704D データシートの表示（PDF） - Unspecified

部品番号

コンポーネント説明

メーカー

MC80F0704D

8-BIT SINGLE-CHIP MICROCONTROLLERS

Unspecified 

28 SOP

MC80F0704/0708/0804/0808

unit: millimetres

MAX

MIN

17.901 BSC

0.512

0.312

1.27 BSC

5 ~ 15°

1.27

0.40

GAUGE PLANE

SEATING PLANE

0 ~ 8°

5 ~ 15°

1.40 REF

1. 17.90 dimension does not include mold FLASH, protrusions or gate burrs.

Mold FLASH, protrusions or gate burrs shall not exceed 0.15mm per end.

7.50 dimension does not include interlead FLASH or protrusion.

Interlead FLASH or protrusion shall not exceed 0.25mm per side.

The package top may be smaller than the package bottom.

17.90 and 7.50 dimensions are determined at the outermost extremes of the plastic body exclusive of mold FLASH.

Tie bar burrs, gate burrs and interlead FLASH, but including any mismatch between the top and bottom of the plastic body.

2. This dimensions apply to the flat section of the lead between 0.10 to 0.25 mm from the lead tip.

Dimension does not include dambar protrusion.

Allowable dambar protrusion shall be 0.10 mm total in excess of the dimension maximum material condition.

The dambar may not be located on the lower radius of the foot.

3. This is defined as the vertical distance from the seating plane to the lowers point on the package body

excluding the thermal enhancemet on cavity down package configurations.

4. This dimensions apply to the flat section of the lead between 0.10 to 0.25 mm from the lead tip.

October 31, 2011 Ver 1.03

7

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