MCP1258 データシートの表示（PDF） - Microchip Technology

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MCP1258

Regulated 3.3V, Low-Ripple Charge Pump with Low-Operating Current SLEEP Mode or BYPASS Mode

Microchip Technology 

MCP1256/7/8/9

10-Lead Plastic Dual-Flat No-Lead Package (MF) 3x3x0.9 mm Body (DFN) – Saw Singulated

E

b

K

D

p

n

L

D2

PIN 1

ID INDEX

AREA

(NOTE 1)

TOP VIEW

A3

A1

EXPOSED

METAL

PAD

(NOTE 2)

A

EXPOSED

TIE BAR

(NOTE 3)

21

E2

BOTTOM VIEW

Units

INCHES

Dimension Limits

MIN

NOM

MAX

Number of Pins

n

10

Pitch

e

.020 BSC

Overall Height

A

.031

.035

.039

Standoff

A1

.000

.001

.002

Lead Thickness

A3

.008 REF.

Overall Length

E

.112

.118

.124

Exposed Pad Length

(Note 3) E2

.082

.094

.096

Overall Width

D

.112

.118

.124

Exposed Pad Width

(Note 3) D2

.051

.065

.067

Lead Width

b

.008

.010

.015

Contact Length §

L

.012

.016

.020

Contact-to-Exposed Pad §

K

.008

—

—

* Controlling Parameter

§ Significant Characteristic

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Exposed pad varies according to die attach paddle size.

3. Package may have one or more exposed tie bars at ends.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

See ASME Y14.5M

REF: Reference Dimension, usually without tolerance, for information purposes only.

See ASME Y14.5M

JEDEC equivalent: Not Registered

Drawing No. C04-063

MILLIMETERS*

MIN

NOM

10

0.50 BSC

0.80

0.90

0.00

0.02

0.20 REF.

2.85

3.00

2.08

2.39

2.85

3.00

1.30

1.65

0.18

0.25

0.30

0.40

0.20

—

MAX

1.00

0.05

3.15

2.45

3.15

1.70

0.30

0.50

—

Revised 09-12-05

DS21989A-page 16

© 2006 Microchip Technology Inc.

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