MCP1258T データシートの表示（PDF） - Microchip Technology

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MCP1258T

Regulated 3.3V, Low-Ripple Charge Pump with Low-Operating Current SLEEP Mode or BYPASS Mode

Microchip Technology 

10-Lead Plastic Micro Small Outline Package (UN) (MSOP)

MCP1256/7/8/9

E

E1

p

n

B

c

D

2

1

α

φ

A

A2

L

A1

β

(F)

Units

INCHES

MILLIMETERS*

Dimension Limits

MIN

NOM

MAX

MIN

NOM

MAX

Number of Pins

Pitch

n

10

p

.020 BSC

10

0.50 BSC

Overall Height

A

.043

–

–

1.10

Molded Package Thickness

A2

.030

.033

.037

0.75

0.85

0.95

Standoff

A1

.000

.006

0.00

0.15

Overall Width

E

.193 BSC

4.90 BSC

Molded Package Width

E1

.118 BSC

3.00 BSC

Overall Length

D

.118 BSC

3.00 BSC

Foot Length

L

.016

.024

.031

0.40

0.60

0.80

Footprint

Foot Angle

F

.037 REF

0.95 REF

φ

0°

–

8°

0°

–

8°

Lead Thickness

c

.003

–

.009

0.08

–

0.23

Lead Width

B

.006

.009

.012

0.15

0.23

0.30

Mold Draft Angle Top

α

5°

–

15°

5°

–

15°

Mold Draft Angle Bott om

β

5°

–

15°

5°

–

15°

* Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254 mm) per side.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

See ASME Y14.5M

REF: Reference Dimnesion, usually witho ut tolerance, for information purposes only.

See ASME Y14.5M

JEDEC Equivalent: MO-187 BA

Drawing No. C04-021

Revised 09-16-05

© 2006 Microchip Technology Inc.

DS21989A-page 17

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