STTH112RL データシートの表示（PDF） - Unspecified
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STTH112RL Datasheet PDF : 6 Pages
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STTH112/A/U
Fig. 3-1: Relative variation of thermal impedance
junction ambient versus pulse duration (epoxy
FR4, Lleads = 10mm) (DO-41).
Zth(j-c)/Rth(j-c)
1.0
0.9
0.8
0.7
0.6
δ = 0.5
0.5
0.4
0.3
δ = 0.2
0.2
δ = 0.1
0.1 Single pulse
0.0
1.E-01
1.E+00
tp(s)
1.E+01
T
δ=tp/T
1.E+02
tp
1.E+03
Fig. 3-2: Relative variation of thermal impedance
junction ambient versus pulse duration (epoxy
FR4) (SMA).
Zth(j-c)/Rth(j-c)
1.0
0.9
0.8
0.7
0.6 δ = 0.5
0.5
0.4
0.3
δ = 0.2
0.2
δ = 0.1
0.1
Single pulse
0.0
1.E-01
1.E+00
tp(s)
1.E+01
T
δ=tp/T
1.E+02
tp
1.E+03
Fig. 3-3: Relative variation of thermal impedance
junction ambient versus pulse duration (epoxy
FR4)(SMB).
Zth(j-c)/Rth(j-c)
1.0
0.9
0.8
0.7
0.6 δ = 0.5
0.5
0.4
0.3
δ = 0.2
0.2
δ = 0.1
0.1
Single pulse
0.0
1.E-01
1.E+00
tp(s)
1.E+01
T
δ=tp/T
1.E+02
tp
1.E+03
Fig. 4-1: Thermal resistance junction to ambient
versus copper surface under each lead (epoxy
printed circuit board FR4, copper thickness: 35µm)
(DO-41, SMB).
Rth(j-a)(°C/W)
110
100
90
80
70
60
50
40
30
20
10
0
0
1
2
3
SMB
DO-41
Lleads=10mm
S(cm²)
4
5
6
7
8
9
10
Fig. 4-2: Thermal resistance junction to ambient
versus copper surface under each lead (epoxy
printed circuit board FR4, copper thickness: 35µm)
(SMA).
Rth(j-a)(°C/W)
140
130
120
110
100
90
80
SMA
70
60
50
40
30
20
10
S(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
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