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11525-801 データシートの表示(PDF) - AMI Semiconductor

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11525-801 Datasheet PDF : 26 Pages
First Prev 11 12 13 14 15 16 17 18 19 20 Next Last
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     X  T
Table 14: 28-pin SOIC (0.300") Package Dimensions
DIMENSIONS
INCHES
MILLIMETERS
MIN. MAX. MIN. MAX.
A 0.093 0.104 2.35 2.65
A1 0.004 0.012 0.10
0.30
A2 0.08 0.100 2.05
2.55
B 0.013 0.013 0.33 0.51
C 0.009 0.009 0.23 0.32
D 0.697 0.713 17.70 18.10
E 0.291 0.299 7.40 7.60
e
0.05 BSC
1.27 BSC
H 0.393 0.419 10.00 10.65
h 0.010 0.030 0.25 0.75
L 0.016 0.05 0.40 1.27
Θ
0°
8°
0°
8°
28
EH
     X  T
1
B
e
D
BASE PLANE
ALL RADII:
0.005" TO 0.01"
h x 45°
A2 A C
L
A1
SEATING PLANE
April 1999
7° typ.
θ
Table 15: 28-pin SOIC (0.300") Package Characteristics
PARAMETER
Thermal Impedance, Junction to Free-Air
Lead Inductance, Self
Lead Inductance, Mutual
Lead Capacitance, Bulk
Lead Capacitance, Mutual
SYMBOL
ΘJA
L11
L12
C11
C12
CONDITIONS/DESCRIPTION
Air flow = 0 m/s
Center lead
Center lead to any adjacent lead
Center lead to VSS
Center lead to any adjacent lead
TYP.
80
2.53
0.85
0.42
0.08
UNITS
°C/W
nH
nH
pF
pF
4.5.99
,62
18

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