NXP Semiconductors
5. Thermal characteristics
Table 5.
Symbol
Rth(j-mb)
Rth(j-a)
Thermal characteristics
Parameter
thermal resistance from junction to mounting base
thermal resistance from junction to ambient free air
Conditions
see Figure 6
in free air
10
Zth(j-mb)
(K/W)
1
BT152-500RT
SCR
Min Typ Max Unit
-
-
1.1 K/W
-
60
-
K/W
003aad212
10−1
10−2
P
tp
δ=
T
10−3
10−5
10−4
10−3
10−2
10−1
tp
t
T
1
10
tp (s)
Fig 6. Transient thermal impedance from junction to mounting base as a function of pulse width
BT152-500RT
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 9 June 2011
© NXP B.V. 2011. All rights reserved.
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