HCNW312 データシートの表示（PDF） - HP => Agilent Technologies

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HCNW312

2.0 Amp Output Current IGBT Gate Drive Optocoupler

HP => Agilent Technologies 

5

Reflow Temperature Profile

260

240

220

200

180

160

140

120

100

80

60

40

20

0

0

∆T = 115°C, 0.3°C/SEC

∆T = 100°C, 1.5°C/SEC

1

23

4

5

6

7

8

TIME – MINUTES

∆T = 145°C, 1°C/SEC

9 10 11 12

MAXIMUM SOLDER REFLOW THERMAL PROFILE

(NOTE: USE OF NON-CHLORINE ACTIVATED FLUXES IS RECOMMENDED.)

Regulatory Information

Agency/Standard

Underwriters Laboratory (UL)

Recognized under UL 1577, Component Recognition

Program, Category, File E55361

Canadian Standards Association (CSA)

File CA88324, per Component Acceptance

Notice #5

Verband Deutscher Electrotechniker (VDE)

DIN VDE 0884 (June 1992)

British Standards Institute (BSI)

Certification According to BS EN60065: 1994

(BS415:1994), BS EN60950: 1992 (BS7002:1992)

HCPL-3120

Option 060

HCPL-J312

HCNW3120

Pending

Insulation and Safety Related Specifications

Parameter

Minimum External

Air Gap (Clearance)

Minimum External

Tracking (Creepage)

Minimum Internal

Plastic Gap

(Internal Clearance)

Tracking Resistance

(Comparative

Tracking Index)

Isolation Group

Symbol

L(101)

HCPL-

3120

7.1

Value

HCPL-

J312

7.4

L(102) 7.4 8.0

0.08 0.5

CTI >175 >175

IIIa IIIa

HCNW

3120

9.6

10.0

1.0

>200

IIIa

Units

mm

mm

mm

Volts

Conditions

Measured from input terminals to

output terminals, shortest distance

through air.

Measured from input terminals to

output terminals, shortest distance

path along body.

Insulation thickness between emitter

and detector; also known as distance

through insulation.

DIN IEC 112/VDE 0303 Part 1

Material Group (DIN VDE 0110, 1/89,

Table 1)

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