TMP86C829AF データシートの表示（PDF） - Toshiba
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TMP86C829AF Datasheet PDF : 48 Pages
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Quality and Reliability Assurance / Handling Precautions
Table 2.5 Storage conditions, permissible usage Period after unpacking and baking
requirements for each soldering method (3/3)
Products
Name
Air reflow
Infrared reflow
TMP87CH48DF
TMP87PH48U
TMP87PH48DF
TMP87CM53F
TMP87PM53F
TMP87CM64F
TMP87CP64F
TMP87CS64F
TMP87PS64F
TMP87CS68DF
TMP87PS68DF
TMP87CC70F
TMP87CH70F
TMP87CK70AF
TMP87CM70AF
TMP87CH70BF
TMP87CM70BF
TMP87PM70F
TMP87CM71F
TMP87CN71F
TMP87CP71F
TMP87CS71F
TMP87PS71F
TMP87CH74AF
TMP87CM74AF
TMP87PM74F
TMP87CH75F
TMP87CM75F
TMP87PM75F
TMP87CC78F
TMP87CH78F
TMP87CK78F
TMP87CM78F
TMP87PM78F
Note 1: As of March, 2001
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
G
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
G
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
B(72h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
A(168h)
Note 2:
Symbols A (168h), B (72h), C (48h), D (24h), E(12h), G and indicate
the maximum permissible period between unpacking and mounting of
the device, and the required storage conditions for the device. For
details of these conditions, please refer to Table 2.2.
030901
QUA-16
2002-02-20
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