TMP47C823F データシートの表示（PDF） - Toshiba

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TMP47C823F

Quality And Reliability Assurance / Handling Precautions

Toshiba 

Quality and Reliability Assurance / Handling Precautions

(3) For the minimum clearance specification between

a device and a printed circuit board, refer to the

relevant device’s datasheet or databook. If

necessary, achieve the required clearance by

forming the device’s leads appropriately. Do not

use the spacers which are used to raise devices

above the surface of the printed circuit board during soldering to achieve

clearance. These spacers normally continue to expand due to heat, even

after the solder has begun to solidify; this applies severe stress to the

device.

(4) Observe the following precautions when forming the leads of a device

prior to mounting so as to avoid mechanical stress to the device. Also

avoid ending or stretching device leads repeatedly.

(a) Use a tool or jig to secure the lead at its base (where the lead meets

the device package) while bending so as to avoid mechanical stress

to the device. Also avoid bending or stretching device leads

repeatedly.

(b) Be careful not to damage the lead during lead forming.

(c) Follow any other precautions described in the individual datasheets

and databooks for each device and package type.

4.5.2 Socket Mounting

(1) When socket mounting devices on a printed circuit board, use sockets

which match the inserted device’s package.

(2) Use sockets whose contacts have the appropriate contact pressure. If the

contact pressure is insufficient, the socket may not make a perfect contact

when the device is repeatedly inserted and removed; if the pressure is

excessively high, the device leads may be bent or damaged when they are

inserted into or removed from the socket.

(3) When soldering sockets to the printed circuit board, use sockets whose

construction prevents flux from penetrating into the contacts or which

allows flux to be completely cleaned off.

(4) Make sure the coating agent applied to the printed circuit board for

moisture-proofing purposes does not stick to the socket contacts.

(5) If the device leads are severely bent by a socket as it is inserted or

removed and you wish to repair the leads so as to continue using the

device, make sure that this lead correction is only performed once. Do not

use devices whose leads have been corrected more than once.

(6) If the printed circuit board with the devices mounted on it will be

subjected to vibration from external sources, use sockets which have a

strong contact pressure so as to prevent the sockets and devices from

vibrating relative to one another.

030901

QUA-42

2002-02-20

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