VNH3SP30 データシートの表示（PDF） - STMicroelectronics

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VNH3SP30

FULLY INTEGRATED H-BRIDGE MOTOR DRIVER

STMicroelectronics 

MultiPowerSO-30 THERMAL DATA

MultiPowerSO-30 PC Board

VNH3SP30

LCauytohuict kcnoensdsit=io3n5µomf R, CthoapnpdeZr tahremaesa:sfruormemmeinntism(uPmCBpaFdRl4aya-roeuat=to5186mcmm2x).58mm, PCB thickness=2mm,

CHIPSET CONFIGURATION

HIGH SIDE

CHIP

HSAB

LOW SIDE

CHIP A

LSA

LOW SIDE

CHIP B

LSB

Auto and mutual Rthj-amb Vs PCB copper area in open box free air condition (according to page 20

definitions)

°C/W

45

40

35

30

RthA

RthB = RthC

RthAB = RthAC

RthBC

25

20

15

10

5

0

0

5

10

15

20

cm2 of Cu Area (refer to PCB layout)

20/26

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