CY7C1486V33(2004) データシートの表示（PDF） - Cypress Semiconductor

部品番号

コンポーネント説明

メーカー

CY7C1486V33
(Rev.:2004)

72-Mbit (2M x 36/4M x 18/1M x 72) Pipelined Sync SRAM

Cypress Semiconductor 

PRELIMINARY

CY7C1480V33

CY7C1482V33

CY7C1486V33

Document History Page

Document Title: CY7C1480V33/CY7C1482V33/CY7C1486V3372-Mbit (2M x 36/4M x 18/1M x 72) Pipelined Sync SRAM

Document Number: 38-05283

REV.

Orig. of

ECN NO. Issue Date Change

Description of Change

**

114670 08/06/02

PKS New Data Sheet

*A

118281 01/21/03

HGK Changed tCO from 2.4 to 2.6 ns for 250 MHz

Updated features on page 1 for package offering

Removed 30-MHz offering

Updated Ordering Information

Changed Advanced Information to Preliminary

*B

233368 See ECN NJY Changed timing diagrams

Changed logic block diagrams

Modified Functional Description

Modified “Functional Overview” section

Added boundary scan order for all packages

Included thermal numbers and capacitance values for all packages

Included IDD and ISB values

Removed 250-MHz speed grade offering and included 225-MHz speed bin

Changed package outline for 165FBGA package and 209-ball BGA package

Removed 119-BGA package offering

*C

299452 See ECN SYT Removed 225-MHz offering and included 250-MHz speed bin

Changed tCYC from 4.4 ns to 4.0 ns for 250-MHz Speed Bin

Changed ΘJA from 16.8 to 24.63 °C/W and ΘJC from 3.3 to 2.28 °C/W for 100

TQFP Package on Page # 20

Added lead-free information for 100-Pin TQFP, 165 FBGA and 209 BGA

Packages.

Added comment of ‘Lead-free BG packages availability’ below the Ordering

Information

Document #: 38-05283 Rev. *C

Page 30 of 30

Share Link: