M95512-DR データシートの表示（PDF） - STMicroelectronics
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M95512-DR Datasheet PDF : 48 Pages
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Package mechanical data
M95512-W, M95512-R
Figure 26. WLCSP-R – 8-bump wafer-length chip-scale package outline
D
XY
Orientation reference
E
Orientation reference
A
Detail A
B
C
D
E
e1
e3
e2
e
G
Wafer back side
Bump
aaa
A2
A
Side view
123
F
Bump side
eee Z
A1
Detail A
rotated by 90 °C
1. Drawing is not to scale.
Z
b
Seating plane
ME_1Cc
Table 22. WLCSP-R – 8-bump wafer-length chip-scale package mechanical data
Symbol
millimeters
Typ
Min
Max
inches(1)
Typ
Min
Max
A
0.580
0.490
0.670
0.0228
A1
0.230
0.0091
A2
0.350
b(2)
0.322
0.0138
0.0127
D
1.433
1.548
0.0564
E
1.901
2.016
0.0748
e
1.000
0.0394
e1
0.866
0.0341
e2
0.500
0.0197
e3
0.433
0.0170
F
0.284
0.0112
G
0.453
0.0178
N (number of terminals)
8
8
aaa
0.110
eee
0.060
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Measured at the maximum bump diameter parallel to primary datum Z.
0.0193
0.0043
0.0024
0.0264
0.0609
0.0794
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Doc ID 11124 Rev 13
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