MAX8969EWL53 データシートの表示（PDF） - Maxim Integrated

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MAX8969EWL53

Step-Up Converter for Handheld Applications

Maxim Integrated 

MAX8969

Step-Up Converter for Handheld Applications

Absolute Maximum Ratings

IN, OUT_ to GND_................................................-0.3V to +6.0V

EN, TREN to GND_............ -0.3V to lower of (VIN + 0.3V) or 6V

Total LX_ RMS Current (Note 1)....................................3.2ARMS

OUT_ Short Circuit to GND_......................................Continuous

Continuous Power Dissipation (TA = +70°C)

WLP (derate 12mW/NC above +70°C)........................960mW

Operating Temperature Range.............................-40ºC to +85°C

Junction Temperature.......................................................+150°C

Storage Temperature Range............................. -65°C to +150°C

Soldering Temperature (reflow) (Note 2).......................... +260°C

Note 1: LX_ has internal silicon diodes to GND_ and OUT_. It is normal for these diodes to briefly conduct during LX_ transitions.

Avoid steady state conduction of these diodes.

Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile that the

device can be exposed to during board level solder attach and rework. This limit permits only the use of the solder pro-

files recommended in the industry-standard specification JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and Convection

reflow. Preheating is required. Hand or wave soldering is not allowed.

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation

of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum

rating conditions for extended periods may affect device reliability.

Package Thermal Characteristics (Note 1)

WLP

Junction-to-Ambient Thermal Resistance (θJA)...........83°C/W

Junction-to-Case Thermal Resistance (θJC)................50°C/W

Note 3: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer

board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.

Electrical Characteristics

(VIN = 2.6V, TA = -40°C to +85°C, unless otherwise noted. Typical values are TA = +25°C.) (Note 4)

PARAMETER

Operating Input Voltage Range

CONDITIONS

MIN

2.5

Minimum Startup Voltage

Undervoltage Lockout Threshold (UVLO) VIN falling, 75mV hysteresis

2.1

Shutdown Supply Current

VEN = VTREN = VOUT = 0V,

VIN = 4.8V

TA = +25°C

TA = +85°C

Thermal Shutdown Temperature

TJ rising, 20°C hysteresis

BOOST MODE

Peak Output Current

VIN > 2.5V, pulse loading (Note 5)

VOUT = 3.3V

VOUT = 3.5V

Minimum Continuous Output Current

VIN > 2.5V (Note 5)

VOUT = 3.7V

VOUT = 4.25V

VOUT = 5.0V

VOUT = 5.3V

VOUT = 5.5V

Switching Frequency

(Note 6)

TYP

2.3

2.2

0.8

1

+165

MAX

5.5

2.3

5

UNITS

V

V

V

µA

°C

1

A

0.9

0.8

0.7

0.7

A

0.7

0.7

0.7

3

MHz

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