TK11230MBX データシートの表示（PDF） - Toko America Inc

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コンポーネント説明

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TK11230MBX

VOLTAGE REGULATOR WITH ON/OFF SWITCH

Toko America Inc  

TK112xx

APPLICATION INFORMATION (CONT.)

6.) Heat dissipation

Make the copper pattern as large as possible to provide

good heat dissipation (pin 5 is the heatsink).

Maximum power dissipation = 400 mW (When mounted as

recommended) See Figure C.

+

+

GND

Figure C

7.) Handling molded resin packages

All plastic molded packages absorb some moisture from

the air. If moisture absorption occurs prior to soldering the

devise into the printed circuit board, increased separation

of the lead from the plastic molding may occur, degrading

the moisture barrier characteristics of the device. This

property of plastic molding compounds should not be

overlooked, particularly in the case of very small packages,

where the plastic is very thin. In order to preserve the

original moisture barrier properties of the package, devices

are stored and shipped in moisture proof bags, filled with

dry air. The bags should not be opened or damaged prior

to the actual use of the devices. If this is unavoidable, the

devices should be stored in a low relative humidity environ-

ment (40 to 65%) or in an enclosed environment with

desiccant.

Page 20

1-3-96

January, 1996 TOKO, Inc.

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