24C02N データシートの表示（PDF） - Atmel Corporation

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24C02N

Two-wire Serial EEPROM

Atmel Corporation 

AT24C01A/02/04/08A/16A

AT24C04 Ordering Information(1)

Ordering Code

Package

Operation Range

AT24C04-10PU-2.7(2)

AT24C04-10PU-1.8(2)

AT24C04N-10SU-2.7(2)

AT24C04N-10SU-1.8(2)

AT24C04-10TU-2.7(2)

AT24C04-10TU-1.8(2)

AT24C04Y1-10YU-1.8(2) (Not recommended for new design)

AT24C04Y6-10YH-1.8(3)

AT24C04-10TSU-1.8(2)

AT24C04U3-10UU-1.8(2)

8P3

8P3

8S1

8S1

8A2

8A2

8Y1

8Y6

5TS1

8U3-1

Lead-free/Halogen-free/

Industrial Temperature

(–40°C to 85°C)

AT24C04-W1.8-11(4)

Die Sale

Industrial Temperature

(–40°C to 85°C)

Notes:

1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table.

2. “U” designates Green Package + RoHS compliant.

3. “H” designates Green Package + RoHS compliant, with NiPdAu Lead Finish.

4. Available in waffle pack and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request. Please

contact Serial EEPROM Marketing.

8P3

8S1

8A2

8Y1

8Y6

5TS1

8U3-1

–2.7

–1.8

Package Type

8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)

8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)

8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)

8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)

8-lead, 2.00 x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm)

5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)

8-ball, die Ball Grid Away Package (dBGA2)

Options

Low-voltage (2.7V to 5.5V)

Low-voltage (1.8V to 5.5V)

15

0180Z1–SEEPR–5/07

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