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AT24C01A-10TSU-1.8 データシートの表示(PDF) - Atmel Corporation

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AT24C01A-10TSU-1.8
Atmel
Atmel Corporation Atmel
AT24C01A-10TSU-1.8 Datasheet PDF : 27 Pages
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AT24C08A Ordering Information(1)
Ordering Code
Package
Operation Range
AT24C08A-10PU-2.7(2)
8P3
AT24C08A-10PU-1.8(2)
8P3
AT24C08AN-10SU-2.7(2)
8S1
AT24C08AN-10SU-1.8(2)
AT24C08A-10TU-2.7(2)
AT24C08A-10TU-1.8(2)
8S1
Lead-free/Halogen-free/
8A2
Industrial Temperature
8A2
(40°C to 85°C)
AT24C08AY1-10YU-1.8(2) (Not recommended for new design)
8Y1
AT24C08AY6-10YH-1.8(3)
8Y6
AT24C08AU2-10UU-1.8(2
8U2-1
AT24C08A-W1.8-11(4)
Die Sale
Industrial Temperature
(–40°C to 85°C)
Notes:
1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table.
2. “U” designates Green Package + RoHS compliant.
3. “H” designates Green Package + RoHS compliant, with NiPdAu Lead Finish.
4. Available in waffle pack and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request. Please
contact Serial EEPROM Marketing.
8P3
8S1
8A2
8Y1
8Y6
8U2-1
2.7
1.8
Package Type
8-pin, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)
8-lead, 2.00 x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm)
8-ball, die Ball Grid Array Package (dBGA2)
Options
Low Voltage (2.7V to 5.5V)
Low Voltage (1.8V to 5.5V)
16 AT24C01A/02/04/08A/16A
0180Z1–SEEPR–5/07

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