24C02CE データシートの表示（PDF） - Microchip Technology
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24C02CE Datasheet PDF : 24 Pages
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24C02C
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
NOTE 1
12
b
e
c
A
A2
φ
A1
L1
L
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
8
Pitch
e
0.65 BSC
Overall Height
A
–
–
1.20
Molded Package Thickness
A2
0.80
1.00
1.05
Standoff
A1
0.05
–
0.15
Overall Width
E
6.40 BSC
Molded Package Width
E1
4.30
4.40
4.50
Molded Package Length
D
2.90
3.00
3.10
Foot Length
L
0.45
0.60
0.75
Footprint
L1
1.00 REF
Foot Angle
φ
0°
–
8°
Lead Thickness
c
0.09
–
0.20
Notes:
Lead Width
b
0.19
–
0.30
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-086B
DS21202G-page 14
© 2007 Microchip Technology Inc.
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