25AA080C データシートの表示（PDF） - Microchip Technology

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25AA080C

8K SPI Bus Serial EEPROM

Microchip Technology 

25XX080C/D

8-Lead Plastic Micro Small Outline Package (MS or UA) [MSOP]

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

D

N

E

E1

NOTE 1

12

e

b

c

A

A2

φ

A1

L1

L

Units

MILLIMETERS

Number of Pins

Pitch

Dimension Limits

MIN

N

e

NOM

8

0.65 BSC

MAX

Overall Height

Molded Package Thickness

Standoff

A

–

–

1.10

A2

0.75

0.85

0.95

A1

0.00

–

0.15

Overall Width

Molded Package Width

Overall Length

Foot Length

Footprint

Foot Angle

Lead Thickness

E

4.90 BSC

E1

3.00 BSC

D

3.00 BSC

L

0.40

0.60

0.80

L1

0.95 REF

φ

0°

–

8°

c

0.08

–

0.23

Lead Width

b

0.22

–

0.40

Notes:

1. Pin 1 visual index feature may vary, but must be located within the hatched area.

2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.

3. Dimensioning and tolerancing per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information purposes only.

Microchip Technology Drawing C04-111B

DS22151A-page 16

© 2009 Microchip Technology Inc.

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