93C56C(2003) データシートの表示（PDF） - Microchip Technology

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93C56C
(Rev.:2003)

2K Microwire Compatible Serial EEPROM

Microchip Technology 

93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C

8-Lead Plastic Micro Small Outline Package (MS) (MSOP)

E

E1

p

B

n

D

2

1

α

c

(F)

β

A

A2

φ

A1

L

Units

Dimension Limits

Number of Pins

n

Pitch

p

Overall Height

A

Molded Package Thickness

A2

INCHES

MIN

NOM

8

.026 BSC

-

-

.030

.033

MAX

.043

.037

MILLIMETERS*

MIN

NOM

8

0.65 BSC

-

-

0.75

0.85

Standoff

Overall Width

Molded Package Width

Overall Length

A1

.000

-

.006

0.00

-

E

.193 TYP.

4.90 BSC

E1

.118 BSC

3.00 BSC

D

.118 BSC

3.00 BSC

Foot Length

Footprint (Reference)

Foot Angle

Lead Thickness

L

.016

.024

.031

0.40

0.60

F

.037 REF

0.95 REF

φ

0°

-

8°

0°

-

c

.003

.006

.009

0.08

-

Lead Width

Mold Draft Angle Top

Mold Draft Angle Bottom

B

.009

.012

.016

0.22

-

α

5°

-

15°

5°

-

β

5°

-

15°

5°

-

*Controlling Parameter

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not

exceed .010" (0.254mm) per side.

JEDEC Equivalent: MO-187

Drawing No. C04-111

MAX

1.10

0.95

0.15

0.80

8°

0.23

0.40

15°

15°

 2003 Microchip Technology Inc.

DS21794B-page 13

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