93C56B データシートの表示（PDF） - Atmel Corporation
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93C56B Datasheet PDF : 20 Pages
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10.3 8MA2 — 8-pad UDFN
E
1
Pin 1 ID
2
3
4
8
7
D
6
5
TOP VIEW
A2
A
C
SIDE VIEW
A1
E2
b (8x)
8
1
7
Pin#1 ID
6
2
D2
3
5
4
e (6x)
L (8x)
K
Notes:
BOTTOM VIEW
1. This drawing is for general information only. Refer to
Drawing MO-229, for proper dimensions, tolerances,
datums, etc.
2. The Pin #1 ID is a laser-marked feature on Top View.
3. Dimensions b applies to metallized terminal and is
measured between 0.15 mm and 0.30 mm from the
terminal tip. If the terminal has the optional radius on
the other end of the terminal, the dimension should
not be measured in that radius area.
4. The Pin #1 ID on the Bottom View is an orientation
feature on the thermal pad.
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
A
A1
A2
D
D2
E
E2
b
C
L
e
K
MIN
0.50
0.0
-
1.90
1.40
2.90
1.20
0.18
0.30
0.20
NOM
0.55
0.02
-
2.00
1.50
3.00
1.30
0.25
1.52 REF
0.35
0.50 BSC
-
MAX
0.60
0.05
0.55
2.10
1.60
3.10
1.40
0.30
0.40
-
NOTE
3
Package Drawing Contact:
packagedrawings@atmel.com
TITLE
8MA2, 8-pad 2 x 3 x 0.6mm Body, Thermally
Enhanced Plastic Ultra Thin Dual Flat No-Lead
Package (UDFN)
GPC
YNZ
11/26/14
DRAWING NO. REV.
8MA2
G
16 AT93C56B/66B [DATASHEET]
Atmel-8735C-SEEPROM-AT93C56B-66B-Datasheet_012015
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