ACPM-7813 データシートの表示（PDF） - HP => Agilent Technologies

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ACPM-7813

CDMA/AMPS Power Amplifier Module

HP => Agilent Technologies 

IR Reflow Soldering

Figure 27 is a straight-line

representation of the recom-

mended nominal time-tempera-

ture profile from JESD22-A113-B

IR reflow.

235

200

183

150

60 to 150s

above 183°C

100

50

0

30

Preheat

Zone

60

90

Soak

Zone

120

150

180

210

TIME (seconds)

Reflow

Zone

240

270

300

Cooling

Zone

Figure 27. Time-temperature Profile for IR Reflow Soldering Process.

Table 2. IR Reflow Process Zone.

Process Zone

Preheat Zone

Soak Zone

Reflow Zone

Cooling Zone

∆Temperature

25°C to 100°C

100°C to 150°C

150°C to 235°C (240°C MAX)

235°C to 150°C

150°C to 25°C

∆Temperature/∆Time

3°C/s MAX

0.5°C/s MAX (120s MAX)

4.5°C/s TYP

-4.5°C/s TYP

-6°C/s MAX

Table 3. Classification Reflow Profiles.

Convection or IR/Convection

Average ramp-up rate (183°C to peak)

3°C/second max.

Preheat temperature 125 (± 25)°C

120 seconds max.

Temperature maintained above 183°C

60 – 150 seconds

Time within 5°C of actual peak temperature

10 – 20 seconds

Peak temperature range

220 +5/-0°C or 235 +5/-0°C

Ramp-down rate

6°C/second max.

Time 25°C to peak temperature

6 minutes max.

Note:

All temperatures measured refer to the package body surface.

20

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