AD8137(2004) データシートの表示（PDF） - Analog Devices
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AD8137 Datasheet PDF : 24 Pages
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AD8137
OUTLINE DIMENSIONS
5.00 (0.1968)
4.80 (0.1890)
8
4.00 (0.1574)
3.80 (0.1497) 1
5
6.20 (0.2440)
4 5.80 (0.2284)
0.25 (0.0098)
0.10 (0.0040)
COPLANARITY
0.10
1.27 (0.0500)
BSC
1.75 (0.0688)
1.35 (0.0532)
0.50 (0.0196) × 45°
0.25 (0.0099)
0.51 (0.0201)
SEATING 0.31 (0.0122)
PLANE
8°
0.25 (0.0098) 0° 1.27 (0.0500)
0.17 (0.0067) 0.40 (0.0157)
COMPLIANT TO JEDEC STANDARDS MS-012AA
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
PIN 1
INDICATOR
Figure 70. 8-Lead Standard Small Outline Package [SOIC]
Narrow Body (R-8)—Dimensions shown in millimeters (inches)
3.00
BSC SQ
TOP
VIEW
2.75
BSC SQ
0.50
0.40
0.60 MAX
0.30
0.45
0.50
BSC
1
8
EXPOSED
PAD
(BOTTOM VIEW)
5
4
1.50
REF
PIN 1
INDICATOR
1.90
1.75
1.60
0.90 12° MAX
0.85
0.80 MAX
0.65 TYP
0.25
1.60
MIN
1.45
1.30
0.80
0.05 MAX
0.02 NOM
SEATING
0.30
PLANE
0.23
0.18
0.20 REF
Figure 71. 8-Lead Lead Frame Chip Scale Package [LFCSP]
3 mm × 3 mm Body (CP-8-2)—Dimensions shown in millimeters
ORDERING GUIDE
Model
Temperature Range
AD8137YR
−40°C to +125°C
AD8137YR-REEL
−40°C to +125°C
AD8137YR-REEL7
−40°C to +125°C
AD8137YRZ1
−40°C to +125°C
AD8137YRZ-REEL1
−40°C to +125°C
AD8137YRZ-REEL71 −40°C to +125°C
AD8137YCP-R2
–40°C to +125°C
AD8137YCP-REEL
–40°C to +125°C
AD8137YCP-REEL7 –40°C to +125°C
AD8137YCPZ-R21
–40°C to +125°C
AD8137YCPZ-REEL1 –40°C to +125°C
AD8137YCPZ-REEL71 –40°C to +125°C
Package Description
8-Lead Standard Small Outline Package (SOIC)
8-Lead Standard Small Outline Package (SOIC)
8-Lead Standard Small Outline Package (SOIC)
8-Lead Standard Small Outline Package (SOIC)
8-Lead Standard Small Outline Package (SOIC)
8-Lead Standard Small Outline Package (SOIC)
8-Lead Lead Frame Chip Scale Package (LFCSP)
8-Lead Lead Frame Chip Scale Package (LFCSP)
8-Lead Lead Frame Chip Scale Package (LFCSP)
8-Lead Lead Frame Chip Scale Package (LFCSP)
8-Lead Lead Frame Chip Scale Package (LFCSP)
8-Lead Lead Frame Chip Scale Package (LFCSP)
Package Option
R-8
R-8
R-8
R-8
R-8
R-8
CP-8-2
CP-8-2
CP-8-2
CP-8-2
CP-8-2
CP-8-2
Branding
HFB
HFB
HFB
HGB
HGB
HGB
1 Z = Pb-free part.
© 2004 Analog Devices, Inc. All rights reserved. Trademarks and regis-
tered trademarks are the property of their respective owners.
D04771–0–8/04(A)
Rev. A | Page 24 of 24
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