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AD818 データシートの表示(PDF) - Analog Devices

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AD818 Datasheet PDF : 16 Pages
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AD818
ABSOLUTE MAXIMUM RATINGS1
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 18 V
Internal Power Dissipation2
Plastic (N) . . . . . . . . . . . . . . . . . . . . . . See Derating Curves
Small Outline (R) . . . . . . . . . . . . . . . . . See Derating Curves
Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . . ± VS
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . ± 6 V
Output Short-Circuit Duration . . . . . . . . See Derating Curves
Storage Temperature Range (N, R) . . . . . . . . –65C to +125C
Operating Temperature Range . . . . . . . . . . . . –40C to +85C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . . 300C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2Specification is for device in free air: 8-lead plastic package, JA = 90C/W; 8-lead
SOIC package, JA = 155C/W.
2.0
TJ = 150 C
8-LEAD MINI-DIP PACKAGE
1.5
1.0
0.5
8-LEAD SOIC PACKAGE
0
–50 –40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90
AMBIENT TEMPERATURE (؇C)
Figure 3. Maximum Power Dissipation vs. Temperature
for Different Package Types
Model
AD818AN
AD818AR
AD818AR-REEL
AD818AR-REEL7
ORDERING GUIDE
Temperature Range
–40C to +85C
–40C to +85C
–40C to +85C
–40C to +85C
Package Description
8-Lead Plastic PDIP
8-Lead Plastic SOIC
13" Tape and Reel
7" Tape and Reel
Package Option
N-8
R-8
R-8
R-8
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
AD818 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
METALLIZATION PHOTOGRAPH
Dimensions shown in inches and (mm)
OFFSET OFFSET
NULL NULL
+VS
1
8
7
–INPUT 2
+INPUT 3
4
–VS
0.0559 (1.42)
–4–
0.0523
(1.33)
6 OUTPUT
REV. C

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