ADG1402BRMZ-REEL7 データシートの表示（PDF） - Analog Devices
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ADG1402BRMZ-REEL7 Datasheet PDF : 16 Pages
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OUTLINE DIMENSIONS
ADG1401/ADG1402
3.20
3.00
2.80
3.20
3.00
2.80
PIN 1
IDENTIFIER
8
5
1
4
0.65 BSC
5.15
4.90
4.65
0.95
15° MAX
0.85
1.10 MAX
0.75
0.15
0.05
COPLANARITY
0.40
0.25
6°
0.23
0°
0.09
0.80
0.55
0.40
0.10
COMPLIANT TO JEDEC STANDARDS MO-187-AA
Figure 28. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
1.75
2.00 BSC
1.65
1.50
5
8
INDEX
AREA
0.80
0.75
0.70
SEATING
PLANE 0.50
TOP VIEW
SIDE VIEW
0.30
0.25
0.20
3.00 BSC
0.20 MIN
0.50
0.40
0.30
0.15 REF
COPLANARITY
0.05 MAX 0.08
0.02 NOM
EXPOSED
PAD
1.90
1.80
1.65
4
1
BOTTOM VIEW
PIN 1
INDICATOR
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 29. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD]
3 mm × 2 mm Body, Very Very Thin, Dual Lead
(CP-8-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model
ADG1401BRMZ1
ADG1401BRMZ-REEL71
ADG1401BCPZ-REEL71
ADG1402BRMZ1
ADG1402BRMZ-REEL71
ADG1402BCPZ-REEL71
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
Package Description
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Lead Frame Chip Scale Package [LFCSP_WD]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Lead Frame Chip Scale Package [LFCSP_WD]
1 Z = RoHS Compliant Part.
Package Option
RM-8
RM-8
CP-8-4
RM-8
RM-8
CP-8-4
Branding
S2T
S2T
2Y
S2U
S2U
1F
Rev. 0 | Page 15 of 16
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