ADG1404YCPZ-REEL7 データシートの表示（PDF） - Analog Devices

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ADG1404YCPZ-REEL7

2Ω Max On Resistance, ±15 V/12 V/±5 V 4:1 iCMOS™ Multiplexer

Analog Devices 

Preliminary Technical Data

OUTLINE DIMENSIONS

5.10

5.00

4.90

14

8

4.50

4.40

4.30

1

6.40

BSC

7

PIN 1

1.05

0.65

1.00

BSC

0.80

1.20 0.20

MAX 0.09

0.75

0.15 0.30

0.05 0.19

8°

SEATING

PLANE

0°

COPLANARITY

0.10

0.60

0.45

COMPLIANT TO JEDEC STANDARDS MO-153AB-1

Figure 32. 14-Lead Thin Shrink Small Outline Package [TSSOP]

(RU-14)

Dimension shown in millimeters

4.00

BSC SQ

PIN 1

INDICATOR

TOP

VIEW

12° MAX

0.80 MAX

0.65 TYP

1.00

0.85

0.30

0.80

0.23

SEATING

PLANE

0.18

0.60 MAX

3.75

BSC SQ

0.65 BSC

0.75

0.60

0.50

0.60 MAX

PIN 1

INDICATOR

13

16

12

1

EXPOSED

PAD

(BOTTOM VIEW)

9

4

8

5

2.25

2.10 SQ

1.95

0.25 MIN

1.95 BSC

0.05 MAX

0.02 NOM

0.20 REF COPLANARITY

0.08

COMPLIANT TO JEDEC STANDARDS MO-220-VGGC

Figure 33. 16-Lead Lead Frame Chip Scale Package [VQ_LFCSP]

4 mm × 4 mm Body, Very Thin Quad

(CP-16-4)

Dimensions shown in millimeters

ORDERING GUIDE

Model

ADG1404YRUZ1

ADG1404YRUZ-REEL1

ADG1404YRUZ-REEL71

ADG1404YCPZ-500RL71

ADG1404YCPZ-REEL71

1 Z = Pb-free part.

Temperature Range

−40°C to +125°C

−40°C to +125°C

−40°C to +125°C

−40°C to +125°C

−40°C to +125°C

Package Description

Thin Shrink Small Outline Package (TSSOP)

Thin Shrink Small Outline Package (TSSOP)

Thin Shrink Small Outline Package (TSSOP)

Lead Frame Chip Scale Package (VQ_LFCSP)

Lead Frame Chip Scale Package (VQ_LFCSP)

ADG1404

Package Option

RU-14

RU-14

RU-14

CP-16-4

CP-16-4

Rev. PrB | Page 15 of 17

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