ADG1406BRUZ データシートの表示（PDF） - Analog Devices
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ADG1406BRUZ
Analog Devices
ADG1406BRUZ Datasheet PDF : 20 Pages
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ADG1406/ADG1407
OUTLINE DIMENSIONS
9.80
9.70
9.60
28
1
PIN 1
0.15
0.05
COPLANARITY
0.10
0.65
BSC
0.30
0.19
15
4.50
4.40
4.30
6.40 BSC
14
1.20 MAX
8°
0.75
0.20
SEATING
PLANE
0.09
0°
0.60
0.45
COMPLIANT TO JEDEC STANDARDS MO-153-AE
Figure 38. 28-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-28)
Dimensions shown in millimeters
PIN 1
INDICATOR
5.00
BSC SQ
TOP
VIEW
4.75
BSC SQ
0.60 MAX
0.50
BSC
0.50
0.40
0.30
0.60 MAX
25
24
32
1
EXPOSED
PAD
(BOTTOM VIEW)
17
8
16
9
PIN 1
INDICATOR
3.25
3.10 SQ
2.95
0.25 MIN
12° MAX
0.80 MAX
0.65 TYP
3.50 REF
0.05 MAX
FOR PROPER CONNECTION OF
1.00
0.02 NOM
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
0.85
0.30
0.80
SEATING
0.23
0.20 REF
COPLANARITY
0.08
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
PLANE
0.18
ORDERING GUIDE
Model
ADG1406BRUZ1
ADG1406BRUZ-REEL71
ADG1406BCPZ-REEL71
ADG1407BRUZ1
ADG1407BRUZ-REEL71
ADG1407BCPZ-REEL71
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
Figure 39. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad
(CP-32-2)
Dimensions shown in millimeters
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
Description
28-Lead Thin Shrink Small Outline Package [TSSOP]
28-Lead Thin Shrink Small Outline Package [TSSOP]
32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
28-Lead Thin Shrink Small Outline Package [TSSOP]
28-Lead Thin Shrink Small Outline Package [TSSOP]
32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
1 Z = RoHS Compliant Part.
Package Option
RU-28
RU-28
CP-32-2
RU-28
RU-28
CP-32-2
©2008 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D07419-0-8/08(0)
Rev. 0 | Page 20 of 20
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