ADP1614 データシートの表示（PDF） - Analog Devices

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ADP1614

650 kHz/1.3 MHz, 4 A, Step-Up, PWM, DC-to-DC Switching Converter

Analog Devices 

ADP1614

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

VIN, EN, FB to GND

CLRES to GND

COMP to GND

SS to GND

SW to GND

Operating Junction Temperature Range

Storage Temperature Range

Soldering Conditions

Rating

−0.3 V to +6 V

−0.3 V to VIN

1.0 V to 1.6 V

−0.3 V to +1.3 V

21 V

−40°C to +125°C

−65°C to +150°C

JEDEC J-STD-020

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

Absolute maximum ratings apply individually only, not in

combination.

Data Sheet

THERMAL RESISTANCE

The junction-to-ambient thermal resistance (θJA) of the package

is specified for the worst-case conditions, that is, a device soldered

in a circuit board for surface-mount packages. The θJA is highly

dependent on the application and board layout. In applications

where high maximum power dissipation exists, attention to

thermal board design is required. The value of θJA may vary,

depending on the printed circuit board (PCB) material, layout,

and environmental conditions.

The boundary conditions for the thermal resistance of the

ADP1614 are modeled under natural convection cooling at

25°C ambient temperature, JESD 51-9, and 1 W power input on a

4-layer board.

Table 3. Thermal Resistance1

Package Type

θJA

10-Lead LFCSP

47

θJC

Unit

7.22

°C/W

1 Thermal numbers per JEDEC standard JESD 51-9.

ESD CAUTION

Rev. 0 | Page 4 of 16

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