ADP3416 データシートの表示（PDF） - Analog Devices

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ADP3416

Dual Bootstrapped MOSFET Driver

Analog Devices 

ADP3416

ABSOLUTE MAXIMUM RATINGS*

VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +8 V

BST . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +30 V

BST to SW . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +8 V

SW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –5.0 V to +25 V

IN . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to VCC + 0.3 V

Operating Ambient Temperature Range . . . . . . . 0°C to 70°C

Operating Junction Temperature Range . . . . . . 0°C to 125°C

θJA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 155°C/W

θJC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40°C/W

Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C

Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . . . 300°C

*This is a stress rating only; operation beyond these limits can cause the device to

be permanently damaged. Unless otherwise specified, all voltages are referenced

to PGND.

ORDERING GUIDE

Model

Temperature Package

Range

Description

ADP3416JR 0°C to 70°C 8-Lead Standard

Small Outline (SOIC)

Package

Option

SOIC-8

PIN CONFIGURATION

BST 1

IN 2

NC 3

VCC 4

ADP3416

TOP VIEW

(Not To Scale)

8 DRVH

7 SW

6 PGND

5 DRVL

NC = NO CONNECT

Pin Mnemonic

1

BST

2

IN

3

NC

4

VCC

5

DRVL

6

PGND

7

SW

8

DRVH

PIN FUNCTION DESCRIPTIONS

Function

Floating Bootstrap Supply for the Upper MOSFET. A capacitor connected between BST and SW Pins

holds this bootstrapped voltage for the high side MOSFET as it is switched. The capacitor should be

chosen between 100 nF and 1 ␮F.

TTL-level input signal that has primary control of the drive outputs.

No Connection.

Input Supply. This pin should be bypassed to PGND with ~1 µF ceramic capacitor.

Synchronous Rectifier Drive. Output drive for the lower (synchronous rectifier) MOSFET.

Power Ground. Should be closely connected to the source of the lower MOSFET.

This pin is connected to the buck-switching node, close to the upper MOSFET’s source. It is the floating

return for the upper MOSFET drive signal. It is also used to monitor the switched voltage to prevent turn-

on of the lower MOSFET until the voltage is below ~1 V. Thus, according to operating conditions, the

high low transition delay is determined at this pin.

Buck Drive. Output drive for the upper (buck) MOSFET.

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although

the ADP3416 features proprietary ESD protection circuitry, permanent damage may occur on

devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are

recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

REV. A

–3–

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