AME8811WEAVL データシートの表示（PDF） - AME, Inc

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AME8811WEAVL

300mA CMOS LDO

AME, Inc 

AME

AME8800 / 8811

300mA CMOS LDO

n Thermal Information

Parameter

Thermal Resistance

(Junction to Ambient)

Thermal Resistance

(Junction to Case)

Internal Power Dissiption

Package

SOT-23

SOT-25

SOT-89

TO-92

SOT-23**

SOT-25**

SOT-89*

TO-92**

SOT-23

SOT-25

SOT-89

TO-92

Maximum Junction Temperature

Solder Iron (10 Sec)***

Die Attach

Non-Conductive

Epoxy

Non-Conductive

Epoxy

Conductive Epoxy

Non-Conductive

Epoxy

Conductive Epoxy

Non-Conductive

Epoxy

Non-Conductive

Epoxy

Non-Conductive

Epoxy

Conductive Epoxy

Non-Conductive

Epoxy

Conductive Epoxy

Non-Conductive

Epoxy

Non-Conductive

Epoxy

Non-Conductive

Epoxy

Conductive Epoxy

Non-Conductive

Epoxy

Conductive Epoxy

Non-Conductive

Epoxy

Symbol

θJA

θJC

PD

* Measure θJC on backside center of tab.

** Measure θJC on center of molding compound if IC has no tab.

*** MIL-STD-202G 210F

Maximum

280

280

180

180

150

150

140

140

40

46

80

80

400

400

550

550

625

625

150

350

Unit

oC / W

mW

oC

oC

22

Rev.T.05

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