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APL1117-UC-TU データシートの表示(PDF) - Anpec Electronics

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APL1117-UC-TU Datasheet PDF : 18 Pages
First Prev 11 12 13 14 15 16 17 18
APL1117
Physical Specifications
Terminal Material
Lead Solderability
Packaging
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
2500 devices per reel
Reflow Condition (IR/Convection or VPR Reflow)
Reference JEDEC Standard J-STD-020A APRIL 1999
Pre-heat temperature
183°C
Peak temperature
Time
Classification Reflow Profiles
Average ramp-up rate(183 °C to Peak)
Preheat temperature 125 ± 25 °C)
Temperature maintained above 183 °C
Time within 5 °C of actual peak temperature
Peak temperature range
Ramp-down rate
Time 25 °C to peak temperature
Convection or IR/
Convection
3°C/second max.
120 seconds max.
60 ~ 150 seconds
10 ~ 20 seconds
220 +5/-0 °C or 235 +5/-0 °C
6°C /second max.
6 minutes max.
VPR
10 °C /second max.
60 seconds
215~ 219 °C or 235 +5/-0 °C
10 °C /second max.
Package Reflow Conditions
pkg. thickness 2.5mm
and all bags
Convection 220 +5/-0°C
VPR 215-219 °C
IR/Convection 220 +5/-0 °C
pkg. thickness < 2.5mm and
pkg. volume 350 mm
pkg. thickness < 2.5mm and pkg.
volume <
Convection 235 +5/-0 °C
VPR 235 +5/-0 °C
IR/Convection 235 +5/-0 °C
Copyright ANPEC Electronics Corp.
16
Rev. B.8 - Jun., 2003
www.anpec.com.tw

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