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AT24C02B(2005) データシートの表示(PDF) - Atmel Corporation

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AT24C02B
(Rev.:2005)
Atmel
Atmel Corporation Atmel
AT24C02B Datasheet PDF : 20 Pages
First Prev 11 12 13 14 15 16 17 18 19 20
AT24C02B
AT24C02B Ordering Information(1)
Ordering Code
AT24C02B-10PU-1.8(2)
AT24C02BN-10SU-1.8(2)
AT24C02B-10TU-1.8(2)
AT24C02BY6-10YH-1.8(3)
AT24C02B-10TSU-1.8(2)
AT24C02BU3-10UU-1.8(2)
Package
8P3
8S1
8A2
8Y6
5TS1
8U3-1
Operation Range
Lead-free/Halogen-free/
Industrial Temperature
(–40°C to 85°C)
AT24C02B-W1.8-11(4)
Die Sale
Industrial Temperature
(–40°C to 85°C)
Notes:
1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC characteristics table.
2. “U” designates Green Package & RoHS compliant.
3. “H” designates Green Package & RoHS compliant with NiPdAu lead finish.
4. Available in waffle pack and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request. Please
contact Serial EEPROM Marketing.
8P3
8S1
8A2
8Y6
5TS1
8U3-1
1.8
Package Type
8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)
8-lead, 2.0 mm x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm)
5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)
8-ball, die Ball Grid Away Package (dBGA2)
Options
Low-voltage (1.8V to 5.5V)
13
5126B–SEEPR–10/05

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