AT24C01B-TH-B データシートの表示（PDF） - Atmel Corporation

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AT24C01B-TH-B

Two-wire Serial EEPROM 1K (128 x 8)

Atmel Corporation 

AT24C01B [Preliminary]

AT24C01B Ordering Information

Ordering Code

Package

Operation Range

AT24C01B-PU (Bulk form only)

AT24C01BN-SH-B(1) (NiPdAu Lead Finish)

AT24C01BN-SH-T(2) (NiPdAu Lead Finish)

AT24C01B-TH-B(1) (NiPdAu Lead Finish)

AT24C01B-TH-T(2) (NiPdAu Lead Finish)

AT24C01BY6-YH-T(2) (NiPdAu Lead Finish)

AT24C01B-TSU-T(2)

AT24C01BU3-UU-T(2)

AT24C01B-W-11(3)

8P3

8S1

8S1

8A2

8A2

8Y6

5TS1

8U3-1

Die Sale

Lead-free/Halogen-free/

Industrial Temperature

(–40°C to 85°C)

Industrial Temperature

(–40°C to 85°C)

Notes:

1. “-B” denotes bulk.

2. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP, Ultra Thin Mini MAP, SOT 23 and dBGA2 = 5K per reel.

3. Available in waffle pack, tape and reel, and wafer form; order as SL788 for inkless wafer form. Bumped die available upon

request. Please contact Serial EEPROM Marketing.

8P3

8S1

8A2

8Y6

5TS1

8U3-1

–1.8

Package Type

8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)

8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)

8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)

8-lead, 2.0 mm x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm)

5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)

8-ball, die Ball Grid Away Package (dBGA2)

Options

Low-voltage (1.8V to 5.5V)

13

5156B–SEEPR–5/06

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