AT24C128B(2007) データシートの表示（PDF） - Atmel Corporation

部品番号

コンポーネント説明

メーカー

AT24C128B
(Rev.:2007)

Two-wire Serial EEPROM

Atmel Corporation 

AT24C128B Ordering Information

Ordering Code

Voltage

Package

Operation Range

AT24C128B-PU (Bulk Form Only)

AT24C128BN-SH-B(1) (NiPdAu Lead Finish)

AT24C128BN-SH-T(2) (NiPdAu Lead Finish)

AT24C128B-TH-B(1) (NiPdAu Lead Finish)

AT24C128B-TH-T(2) (NiPdAu Lead Finish)

AT24C128BY6-YH-T(2) (NiPdAu Lead Finish)

AT24C128BY7-YH-T(2) (NiPdAu Lead Finish)

AT24C128BU2-UU-T(2) (NiPdAu Lead Finish)

1.8

8P3

1.8

8S1

1.8

8S1

1.8

8A2

Lead-free/Halogen-free

Industrial Temperature

1.8

8A2

(−40°C to 85°C)

1.8

8Y6

1.8

8Y7

1.8

8U2-1

AT24C128B-W11(3)

1.8

Die Sale

Industrial Temperature

(−40°C to 85°C)

Notes:

1. “-B” denotes bulk.

2. “-T” denotes and tape and reel. SOIC=4K. TSSOP, dBGA2, MiniMAP, and SAP=3K.

3. Available in waffle pack, tape and reel, and wafer form; order as SL788 for inkless wafer form. Bumped die available upon

request. Please contact Serial Interface Marketing.

8P3

8S1

8U2-1

8A2

8Y6

8Y7

−1.8

Package Type

8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)

8-lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)

8-ball, die Ball Grid Array Package (dBGA2)

8-lead, 0.170" Wide, Thin Shrink Small Outline Package (TSSOP)

8-lead, 2.00 mm x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini MAP, Dual No Lead Package, (DFN), (MLP2x3mm)

8-lead, 6.00 mm x 4.90 mm Body, Ultra Thin, Dual Footprint, Non-leaded, Small Array Package (SAP)

Options

Low-voltage (1.8V to 3.6V)

12 AT24C128B [Preliminary]

5208A–SEEPR–1/07

Share Link: