AT24C16B(2006) データシートの表示（PDF） - Atmel Corporation

部品番号

コンポーネント説明

メーカー

AT24C16B
(Rev.:2006)

Two-wire Serial EEPROM

Atmel Corporation 

AT24C16B Preliminary

AT24C16B Ordering Information

Ordering Codes

Voltage

Package

Operating Range

AT24C16B-PU (Bulk Form Only)

1.8

AT24C16BN-SH-B(1) (NiPdAu Lead Finish)

1.8

AT24C16BN-SH-T(2) (NiPdAu Lead Finish)

1.8

AT24C16B-TH-B(1) (NiPdAu Lead Finish)

1.8

AT24C16B-TH-T(2) (NiPdAu Lead Finish)

1.8

AT24C16BY6-YH-T(2) (NiPdAu Lead Finish)

1.8

AT24C16BTSU-T(2)

1.8

AT24C16BU3-UU-T(2)

1.8

8P3

8S1

8S1

8A2

8A2

8Y6

5TS1

8U3-1

Lead-Free

Halogen-Free

Industrial Temperature

(-40°C to 85°C)

AT24C16B-W-11(3)

1.8

Die Sales

Industrial Temperature

(-40°C to 85°C)

Notes:

1. “-B” denotes bulk.

2. “-T” denotes tape and reel. SOIC = 4K per reel. TSSOP, Ultra Thin Mini MAP, SOT23, dBGA2 = 5K per reel.

3. Available in waffle pack, tape and reel, and wafer form; order as SL788 for inkless wafer form. Bumped die available upon

request. Please contact Serial EEPROM Marketing.

8P3

8S1

8A2

8Y6

5TS1

8U3-1

–1.8

Package Type

8-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP)

8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)

8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)

8-lead, 2.0 mm x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3 mm)

5-lead, 2.90 mm x 1.60 mm Body, Plastic Thin Shrink Small Outline Package (SOT23)

8-ball, die Ball Grid Away Package (dBGA2)

Options

Low-voltage (1.8V to 3.6V)

13

5175A–SEEPR–09/06

Share Link: