AT24C64A データシートの表示（PDF） - Atmel Corporation

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AT24C64A

2-Wire Serial EEPROM

Atmel Corporation 

AT24C32A/64A

AT24C32A Ordering Information(1)

Ordering Code

AT24C32A-10PU-2.7(2)

AT24C32A-10PU-1.8(2)

AT24C32AN-10SU-2.7(2)

AT24C32AN-10SU-1.8(2)

AT24C32AW-10SU-2.7(2)

AT24C32AW-10SU-1.8(2)

AT24C32A-10TU-2.7(2)

AT24C32A-10TU-1.8(2)

AT24C32AY1-10YU-1.8(2) (Not recommended for new design)

AT24C32AY6-10YH-1.8(3)

AT24C32A-W1.8-11(4)

Package

8P3

8P3

8S1

8S1

8S2

8S2

8A2

8A2

8Y1

8Y6

Die Sale

Operation Range

Lead-free/Halogen-free/

Industrial Temperature

(–40°C to 85°C)

Industrial Temperature

(–40°C to 85°C)

Notes:

1. For 2.7V devices used in the 4.5V to 5.5V range, please refer to performance values in the AC and DC Characteristics

tables.

2. “U” designates Green Package + RoHS compliant.

3. “H” designates Green Package + RoHS compliant, with NiPdAu Lead Finish.

4. Available in waffle pack and wafer form; order as SL788 for inkless wafer form. Bumped die available upon request. Please

contact Serial EEPROM Marketing.

Package Type

8P3

8-lead, 0.300" Wide, Plastic Dual In-line Package (PDIP)

8S1

8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)

8S2

8-lead, 0.209" Body, Plastic Small Outline (EIAJ SOIC)

8A2

8-lead, 4.4 mm Body, Plastic Thin Shrink Small Outline Package (TSSOP)

8Y1

8-lead, 4.90 mm x 3.00 mm Body, Dual Footprint, Non-leaded, Miniature Array Package (MAP)

8-lead, 2.00 mm x 3.00 mm Body, 0.50 mm Pitch, Ultra Thin Mini-MAP, Dual No Lead Package (DFN), (MLP 2x3

8Y6

mm)

Options

–2.7

Low Voltage (2.7V to 5.5V)

–1.8

Low Voltage (1.8V to 5.5V)

13

3054T–SEEPR–1/07

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