AT24C64C データシートの表示（PDF） - Atmel Corporation
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AT24C64C Datasheet PDF : 28 Pages
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15. Packaging Information
8Y6 - MLP
Pin 1
Index
Area
AT24C32C/64C
A
D2
b
(8X)
Pin 1 ID
L (8X)
D
e (6X)
A2
A1
1.50 REF.
A3
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
D
E
D2
E2
A
A1
A2
A3
L
e
b
MIN
1.40
-
-
0.0
-
0.20
0.20
NOM
2.00 BSC
3.00 BSC
1.50
-
-
0.02
-
0.20 REF
0.30
0.50 BSC
0.25
MAX
1.60
1.40
0.60
0.05
0.55
0.40
0.30
NOTE
2
Notes:
1. This drawing is for general information only. Refer to JEDEC Drawing MO-229, for proper dimensions,
tolerances, datums, etc.
2. Dimension b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the
terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area.
3. Soldering the large thermal pad is optional, but not recommended. No electrical connection is accomplished to the
device through this pad, so if soldered it should be tied to ground
10/16/07
TITLE
DRAWING NO. REV.
2325 Orchard Parkway 8Y6, 8-lead 2.0 x 3.0 mm Body, 0.50 mm Pitch, Utlra Thin Mini-Map,
R San Jose, CA 95131 Dual No Lead Package (DFN) ,(MLP 2x3)
8Y6
D
21
5298A–SEEPR–1/08
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