Atmel AT24C64D Ordering Information
Ordering Code
AT24C64D-SSHM-B(1) (NiPdAu Lead Finish)
AT24C64D-SSHM-T(2) (NiPdAu Lead Finish)
AT24C64D-XHM-B(1) (NiPdAu Lead Finish)
AT24C64D-XHM-T(2) (NiPdAu Lead Finish)
AT24C64D-MAHM-T(2) (NiPdAu Lead Finish)
AT24C64D-MEHM-T(2) (NiPdAu Lead Finish)
AT24C64D-CUM-T(2)
AT24C64D-WWU11M(3)
Voltage
1.7 to 5.5
1.7 to 5.5
1.7 to 5.5
1.7 to 5.5
1.7 to 5.5
1.7 to 5.5
1.7 to 5.5
1.7 to 5.5
Package
8S1
8S1
8A2
8A2
8Y6
8ME1
8U3-1
Die Sale
Operation Range
Lead-free/Halogen-free
Industrial Temperature
(-40C to +85C)
Industrial Temperature
(-40C to +85C)
Notes:
1. “-B” denotes bulk delivery
2. “-T” denotes tape and reel delivery. SOIC = 4K/reel. TSSOP, UDFN, XDFN, SOT23 and VFBGA = 5K/reel
3. For Wafer sales, please contact Atmel Sales
8S1
8A2
8Y6
8ME1
8U3-1
Package Type
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline (JEDEC SOIC)
8-lead, 4.4mm Body, Plastic, Thin Shrink Small Outline Package (TSSOP)
8-lead, 2.00mm x 3.00mm Body, 0.50mm Pitch, Ultra Thin Dual no Lead Package (UDFN)
8-lead, 1.80mm x 2.20mm Body, (XDFN)
8-ball, 1.50mm x 2.00mm Body, 0.50mm Pitch, Small Die Ball Grid Array (VFBGA)
18 Atmel AT24C32D/64D
8717B–SEEPR–6/10