AT24C64D-XHM データシートの表示（PDF） - Atmel Corporation
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AT24C64D-XHM Datasheet PDF : 26 Pages
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8U3-1 – VFBGA
E
D
1. b
PIN 1 BALL PAD CORNER
Top View
PIN 1 BALL PAD CORNER
1
2
3
4
(d1)
A1
A2
A
End View
d
8
7
6
5
e
Bottom View
(e1)
(8 SOLDER BALLS)
Notes: 1. This drawing is for general information only.
2. Dimension ‘b’ is measured at maximum solder
ball diameter.
3. Solder ball composition shall be 95.5Sn-4.0Ag-.5Cu
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
A
A1
A2
b
D
E
e
e1
d
d1
MIN NOM MAX
0.73 0.79 0.85
0.09 0.14 0.19
0.40 0.45 0.50
0.20 0.25 0.30
1.50 BSC
2.00 BSC
0.50 BSC
0.25 REF
1.00 BSC
0.25 REF
NOTE
2
TITLE
Package Drawing Contact: 8U3-1, 8-ball, 1.50 x 2.00mm Body, 0.50mm pitch,
packagedrawings@atmel.com VFBGA Package (dBGA2)
9/19/07
DRAWING NO. REV.
PO8U3-1
C
24 Atmel AT24C32D/64D
8717B–SEEPR–6/10
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