5962-8863401ZX データシートの表示（PDF） - Atmel Corporation
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5962-8863401ZX Datasheet PDF : 25 Pages
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27. Ordering Information(1)
27.1 Standard Package
tACC
ICC (mA)
(ns)
Active
Standby
Ordering Code
70
80
60
AT28HC256(E,F)-70JC
AT28HC256(E,F)-70PC
0.3
AT28HC256(E,F)-70JI
AT28HC256(E,F)-70PI
90
80
0.3
AT28HC256(E,F)-90JC
AT28HC256(E,F)-90PC
AT28HC256(E,F)-90JI
AT28HC256(E,F)-90PI
80
0.3
AT28HC256(E,F)-90DM/883
AT28HC256(E,F)-90FM/883
AT28HC256(E,F)-90LM/883
AT28HC256(E,F)-90UM/883
120
80
0.3
AT28HC256(E,F)-12JC
AT28HC256(E,F)-12PC
AT28HC256(E,F)-12SC
AT28HC256(E,F)-12TC
80
0.3
AT28HC256(E,F)-12JI
AT28HC256(E,F)-12PI
AT28HC256(E,F)-12SI
AT28HC256(E,F)-12TI
80
0.3
AT28HC256(E,F)-12DM/883
AT28HC256(E,F)-12FM/883
AT28HC256(E,F)-12LM/883
AT28HC256(E,F)-12UM/883
Package
32J
28P6
32J
28P6
32J
28P6
32J
28P6
28D6
28F
32L
28U
32J
28P6
28S
28T
32J
28P6
28S
28T
28D6
28F
32L
28U
28D6
28F
32J
32L
28P6
28S
28T
28U
W
Blank
E
F
Package Type
28-lead, 0.600" Wide, Non-windowed, Ceramic Dual Inline Package (Cerdip)
28-lead, Non-windowed, Ceramic Bottom-brazed Flat Package (Flatpack)
32-lead, Plastic J-leaded Chip Carrier (PLCC)
32-pad, Non-windowed, Ceramic Leadless Chip Carrier (LCC)
28-lead, 0.600" Wide, Plastic Dual Inline Package (PDIP)
28-lead, 0.300" Wide Plastic Gull Wing Small Outline (SOIC)
28-lead, Plastic Thin Small Outline Package (TSOP)
28-pin, Ceramic Pin Grid Array (PGA)
Die
Options
Standard Device: Endurance = 10K Write Cycles; Write Time = 10 ms
High Endurance Option: Endurance = 100K Write Cycles
Fast Write Option: Write Time = 3 ms
0007J–PEEPR–04/05
AT28HC256
Operation Range
Commercial
(0°C to 70°C)
Industrial
(-40°C to 85°C)
Commercial
(0°C to 70°C)
Industrial
(-40°C to 85°C)
Military/883C
Class B, Fully Compliant
(-55°C to 125°C)
Commercial
(0°C to 70°C)
Industrial
(-40°C to 85°C)
Military/883C
Class B, Fully Compliant
(-55°C to 125°C)
13
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