ATF-541M4 データシートの表示（PDF） - HP => Agilent Technologies

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ATF-541M4

Low Noise Enhancement Mode Pseudomorphic HEMT in a Miniature Leadless Package

HP => Agilent Technologies 

briefly elevates the temperature

sufficiently to produce a reflow

of the solder.

The recommended lead-free

reflow profile is shown in Fig-

ure 22.

The rates of change of tempera-

ture for the ramp-up and cool-

down zones are chosen to be low

enough to not cause deformation

of board or damage to compo-

nents due to thermal shock. The

maximum temperature in the

reflow zone (Tmax) should not

exceed 235°C for leaded solder.

These parameters are typical for

a surface mount assembly

process for the ATF-541M4. As a

general guideline, the circuit

board and components should

only be exposed to the minimum

temperatures and times the

necessary to achieve a uniform

reflow of solder.

Electrostatic Sensitivity

FETs and RFICs are electrostatic

discharge (ESD) sensitive de-

vices. Agilent devices are manu-

factured using a very robust and

reliable PHEMT process, however,

permanent damage may occur to

these devices if they are sub-

jected to high-energy electrostatic

discharges. Electrostatic charges

as high as several thousand volts

(which readily accumulate on the

human body and on test equip-

ment) can discharge without

detection and may result in

failure or degradation in perfor-

mance and reliability.

250

TMAX

200

150

Reflow

Zone

100

Preheat

Zone

Cool Down

Zone

50

0

0

60

Figure 21. Leaded Solder Reflow Profile.

120

180

TIME (seconds)

240

300

Electronic devices may be

subjected to ESD damage in any

of the following areas:

• Storage & handling

• Inspection

• Assembly & testing

• In-circuit use

The ATF-541M4 is an ESD Class 1

device. Therefore, proper ESD

precautions are recommended

when handling, inspecting,

testing, and assembling these

devices to avoid damage.

Any user-accessible points in

wireless equipment (e.g. antenna

or battery terminals) provide an

opportunity for ESD damage.

For circuit applications in which

the ATF-541M4 is used as an

input or output stage with close

coupling to an external antenna,

the device should be protected

from high voltage spikes due to

human contact with the antenna.

A good practice, illustrated in

Figure 23, is to place a shunt

inductor or RF choke at the

antenna connection to protect

the receiver and transmitter

circuits. It is often advantageous

to integrate the RF choke into the

design of the diplexer or T/R

switch control circuitry.

350

Peak Temperature

300

Min. 240°C

Max. 255°C

250

221

200

Reflow Time

Min. 60s

150

Max. 90s

100

Preheat 130 – 170°C

Min. 60s

50

Max. 150s

0

0 30 60 90 120 150 180 210 240 270 300 330 360

TIME (seconds)

Figure 22. Lead-free Solder Reflow Profile.

11

Figure 23. In-circuit ESD Protection.

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