TK114XX データシートの表示（PDF） - Toko America Inc

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TK114XX

VOLTAGE REGULATOR WITH ON/OFF SWITCH

Toko America Inc  

TK114xx

TYPICAL APPLICATIONS

CONTROL FUNCTION UTILIZED

CONTROL FUNCTION NOT UTILIZED

VIN

(See Note)

S

S

+

1mF

654

S

VO

+

4.7 mF

IN

S

TK114xx

100K

R MAX= 100KW

PULL-UP RESISTOR

Rmax/N Devices

S

12

3

S

S

S

S

ON/OFF

Control

(Optional)

To other TK114xx Devices

TA01

Note: Parallel connection of control pins is allowed if all devices use identical input voltage.

S

OUT

+

10 mF

TC02

PRINTED CIRCUIT BOARD LAYOUT

+

+

SCALE: 10:1

GND

0.95 mm

KT114xx • PCBL01

Application Hints

Maximize copper foil area connecting to all IC pins for

optimum performance. Place input and output bypass

capacitors close to the GND pin. For best transient behav-

ior and lowest output impedance, use as large a capacitor

value as possible. The temperature coefficient of the ca-

pacitance and Equivalent Series Resistance (ESR) should

be taken into account. These parameters can influence

power supply noise and ripple rejection. In extreme cases,

oscillation may occur. In order to maintain stability, the

output bypass capacitor value should be minimum 2.2 µF

for a Tantalum electrolytic or 4.7 µF for an Aluminum

electrolytic.

Handling Molded Resin Packages

All plastic molded packages absorb some moisture from

the air. If moisture absorption occurs prior to soldering the

device into the printed circuit board, increased separation

of the lead from the plastic molding may occur, degrading

the moisture barrier characteristics of the device.

This property of plastic molding compounds should not be

overlooked, particularly in the case of very small packages,

where the plastic is very thin.

In order to preserve the original moisture barrier properties

of the package, devices are stored and shipped in moisture

proof bags, filled with dry air. The bags should not be

opened or damaged prior to the actual use of the devices.

If this is unavoidable, the devices should be stored in a low

relative humidity environment (40 to 65%) or in an enclosed

environment with desiccant.

Page 22

11-20-94

January, 1995 TOKO, Inc.

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