BGX7100 データシートの表示（PDF） - NXP Semiconductors.
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BGX7100 Datasheet PDF : 38 Pages
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NXP Semiconductors
16. Package outline
HVQFN24: plastic thermal enhanced very thin quad flat package; no leads;
24 terminals; body 4 x 4 x 0.85 mm
D
BA
BGX7100
Transmitter IQ modulator
SOT616-3
terminal 1
index area
A
A1
E
c
detail X
e1
C
1/2 e
e
b
vMC A B
y1 C
y
7
12
wM C
L
13
6
e
Eh
e2
1/2 e
1
18
terminal 1
index area
24
19
Dh
X
0
2.5
5 mm
DIMENSIONS (mm are the original dimensions)
scale
UNIT A(1)
max.
A1
b
c
D(1) Dh E(1) Eh
e
e1 e2
L
vw
y
y1
mm
1
0.05
0.00
0.30
0.18
0.2
4.1
3.9
2.75
2.45
4.1
3.9
2.75
2.45
0.5
2.5 2.5
0.5
0.3
0.1 0.05 0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
EUROPEAN
PROJECTION
SOT616-3
---
MO-220
---
ISSUE DATE
04-11-19
05-03-10
Fig 53. Package outline SOT616-3 (HVQFN24)
BGX7100
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 5 — 3 September 2012
© NXP B.V. 2012. All rights reserved.
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